{"code":0,"message":"","data":{"typeDesc":"新闻快讯","releaseTime":"2026-07-10T20:46:50","createPsn":"何里玉","firstColumnCode":"JSKX","collectFlag":0,"source":"经理人融媒体中心","title":"财通资本已投企业托伦斯成功上市","type":"XW","likesFlag":0,"collectAmount":0,"content":"<p style=\"text-indent: 2em; text-align: left;\">7月10日，财通资本已投企业托伦斯精密制造（江苏）股份有限公司（股票简称：托伦斯，股票代码：301583）正式在深圳证券交易所创业板挂牌上市。上市首日，盘中一度大涨1070%，触发临停，总市值突破400亿元。这是财通资本深耕硬科技赛道的又一标志性成果，也是财通证券加速打造“科创型财通”的重要里程碑。</p><p style=\"text-align: center;\"><img src=\"https://www.sino-manager.com/admin/manager/open/file/download/cad1c37d-0742-4c50-a54c-e94493f2b01b.png\" alt=\"\" data-href=\"\" style=\"\"></p><p style=\"text-indent: 2em; text-align: left;\">托伦斯</p><p style=\"text-indent: 2em; text-align: left;\">作为国内半导体设备领域的核心厂商，托伦斯专注于高端薄膜沉积设备的研发与国产化替代，产品广泛应用于逻辑芯片、存储芯片等前沿制造环节，技术壁垒深厚，成长空间广阔。财通资本凭借对半导体产业链的深度理解与专业判断，坚定支持企业技术攻关与产能扩张，伴随企业一路成长为细分赛道龙头。</p><p style=\"text-align: center;\"><img src=\"https://www.sino-manager.com/admin/manager/open/file/download/09a6c886-e8fd-44ba-899a-bfb3a8f08267.png\" alt=\"\" data-href=\"\" style=\"\"></p><p style=\"text-indent: 2em; text-align: left;\">财通资本深入践行集团“科创型财通”战略，坚持“投稳、投准、投好”，通过参控股一批核心科创企业、绑定一批链主型科创企业、培育一批上市后备科创企业、孵化一批早期科创企业，构建覆盖科创企业全生命周期的投资生态，以耐心资本陪伴更多硬科技企业成长壮大，为服务新质生产力发展持续贡献财通力量。</p>","downloadAmount":0,"filePageAmount":0,"releaseDateStr":"2026-07-10 20:46:50","fileUrl":"","readAmount":0,"columnCode":"","id":19736,"keyword":"","likesAmount":0,"statusDesc":"已上架","createPsnId":179,"firstColumnName":"即时快讯","updateTime":"2026-07-10 20:47:11","coverImgUrl":"","isExistFile":0,"createTime":"2026-07-10 20:47:11","authorName":"","isTop":0,"simpleContent":"","contentLength":0,"status":1,"columnName":null}}